The XTIOT XT2001CM is a compact core scanning module designed for integration into ultra-thin embedded devices. With its stamp-hole PCB design, it can be directly SMT-mounted on POS mainboards, supporting high-density product integration while maintaining professional scanning performance for Data Matrix codes, QR codes, and SSCC logistics tracking.

Compact and Ultra-Thin Design

• PCB dimensions: 35 × 25 × 1.5 mm

• Stamp-hole design: 1.5 mm spacing for direct SMT mounting

• Split core board and lens module for integration in ultra-thin embedded products

This enables POS terminals, handheld devices, and self-service kiosks to embed professional scanning technology without increasing device thickness.

High-Precision Imaging

• Sensor: 640 × 480 CMOS

• Decoding precision: ≥ 5 mil (high-density barcode reading)

• Supports small and high-density Data Matrix codes, QR codes, and serialized SSCC codes

• Optimized for screen and printed barcode reading

The XT2001CM ensures reliable scanning performance even in compact or challenging embedded environments.

Typical Applications

• POS terminals requiring integrated scan modules

• Ultra-thin handheld or embedded devices

• Self-service kiosks and payment terminals

• Embedded logistics or traceability systems using Data Matrix and SSCC codes

Its split design allows flexibility in embedding within devices of limited space while maintaining scanning quality.

Advantages of XT2001CM Core Board

• Ultra-compact and easy SMT integration

• Supports high-density barcode scanning (≥ 5 mil)

• Compatible with Data Matrix, QR codes, and SSCC codes

• Split core board and lens design for ultra-thin embedded product integration

• Reliable performance for POS, kiosks, and embedded traceability systems

Summary

The XTIOT XT2001CM stamp-hole core board combines ultra-thin PCB design, high-precision scanning, and flexible integration.

It enables embedded POS, kiosk, and traceability devices to decode Data Matrix and SSCC codes reliably while maintaining compact form factor and ultra-thin device design.